Monday, April 30, 2012

Samsung Galaxy S III Rumor Roundup Day 1

it is Monday 30th of April, There is about 4 more days till the Samsung Galaxy S III is being revealed at London. In this few days coming up to the launch we here at the Technology Of Today will bring you any Galaxy S III new big or small at any time of the day. Please go to our facebook page to see updates because we will only upload a new post at the end of the day, so like our facebook page to get the most latest news. Ok back to Business, today there are a few rumors.


1st Rumor

This first rumor came from GSMArena, they got the tip from Ali. They mentioned that the photo they recieved didn't come with any extra info on the handset, but the leaked specifications for the device so far detail a 4.6 or 4.8-inch SuperAMOLED screen of 720p resolution, powered by Samsung's latest quad-core Exynos 4 Quad processor, and an 8 or 12 megapixel camera paired up. There should also be an extra beefier battery to make the phone last a bit longer.


Source: GSMArena






2nd Rumor
The Next rumor is about the Galaxy S III screen size. in the picture is shown a phone and a ruler beside of it. of course this may just be another dummybox, but nevertheless it adds up to the rumored 4.8" screen size. 
Source: Wccftech



Samsung Galaxy S III Confirm List: 2/7
8 MP camera
4.65-4.8" screen 
Quad core Processor Confirmed
Number of Physical/capacitive buttons
Micro Sim Technology
NFC Technology
Android 4.0 Ice cream Sandwich Confirmed
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Sunday, April 29, 2012

MSI Z77 Reaching The Overclocking Limits



The Z77 series mainboard released by MSI is equipped with Military Class III components, and has met 7 rigorous testing standards conforming to MIL-STD-810Gvia third-party laboratories, certifying it for the best quality and highest stability! Equipped with a Hybrid Digital Power design, it allows voltage options to be more precisely adjusted, providing a more stable power source that can achieve a higher overclocking result.
Equipped with Intel’s 3rd Gen Core processor, its overclocking potential is astounding: using the MSI Z77A-GD65 mainboard, the i7-3770K processor can successfully be overclocked from the default speed of 3.5GHz up to 7GHz, with a 200% overclocking margin! In addition, MSI’s Z77 series mainboard exclusively integrates the UEFI BIOS and Windows application into one unified interface: Click BIOS II. MSI Z77 series mainboard leads global users towards an all-new overclocking realm with unlimited possibilities!
Military Class III components and Hybrid Digital Power anchor the most stable overclocking platform!
MSI’s Z77 series mainboard uses Military Class III components, which have passed 7 rigorous tests meeting MIL-STD-810Gstandards as tested by third party laboratories. Military Class III features DrMOS II and Double Thermal Protection, which provides active protection from component damage under extreme conditions. Two levels of thermal prevention are present: when the temperature reaches approximately115℃, a LED indicator on the mainboard will light up as a reminder to monitor the MOSFET’s cooling status, and when the working temperature reaches130℃, the mainboard will automatically shut down to prevent damage from excessive thermal conditions. Along with Hi-c CAP, SFC and Solid CAP components, MSI’s Z77 boards allow users to enjoy the best quality. The Z77 series mainboard also features a Hybrid Digital Power design that, when compared to traditional power modules, can adjust overclocking-related power supply options with more precision, providing a more stable power source to achieve a higher overclocking result.
Click BIOS II provides a friendlier overclocking experience.
Click BIOS II is the world’s first utility tool that integrates UEFI BIOS and Windows application into a common interface, allowing usage of mice or LCD touch panel control for system adjustment under different environments. It is the industry’s most convenient system control experience. Click BIOS II is also the world’s first BIOS featuring overclock setting export via USB flash drives, allowing overclocking enthusiasts to share profiles with other users or upload them onto the internet.  The detailed graphical interface helps users easily understand and monitor overall system conditions, making the overclocking experience more efficient and intuitive.
OC Genie II: The easiest overclocking tool on the market with support for the next generation PCI Express Gen 3 specification
MSI’s exclusive OC Genie II technology only requires 1 second to produce an amazing jump in performance. With the push of a button, it simultaneously increases the CPU, iGPU and memory performance. MSI’s Z77 series mainboard also features support for the newest PCE Express Gen 3 specification, and is able to provide a staggering 32GB/s bandwidth that is double the previous generation, achieving a better user usage experience.
Source: Wccftech, MSI
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Saturday, April 28, 2012

Geforce GTX 690


NVIDIA today announced their Dual GPU card the GTX 690, it is also the world’s fastest consumer graphics card with a bold industrial design to match. Powered by the dual Kepler™ architecture-based on GeForce GPUs, the GTX 690 is meticulously designed  inside and out  to deliver the most refined, elegant and smooth PC gaming experience possible. The surprise announcement was made by NVIDIA CEO and co-founder Jen-Hsun Huang during his keynote address at the NVIDIA Game Festival in Shanghai, which is being attended by more than 6,000 gamers from across China. This card was Engineered to reach a new threshold in gaming performance, the GTX 690 also looks the part. Its array of innovative technologies is complemented by sleek materials that contribute to the exotic design of the card, including:
  • An exterior frame made from trivalent chromium-plated aluminum, providing excellent strength and durability
  • A fan housing made from a thixomolded magnesium alloy, which offers excellent heat dissipation and vibration dampening
  • High-efficiency power delivery with less resistance, lower power and less heat generated using a 10-phase, heavy-duty power supply with a 10-layer, two-ounce copper printed circuit board
  • Efficient cooling using dual vapor chambers, a nickel-plated finstack and center-mounted axial fan with optimized fin pitch and air entry angles
  • Low-profile components and ducted baseplate channels for unobstructed airflow, minimizing turbulence and improving acoustic quality
The GTX 690 is powered by a total of 3,072 NVIDIA CUDA® cores, all working to deliver awesome gaming performance for ultimate gaming setups. Designed for the discriminating gamer and ultra-high-resolution, multimonitor NVIDIA Surround™ configurations, the GTX 690 delivers close to double the frame rates of the closest single GPU product, the GTX 680. Plus, it is more power efficient and quieter when compared to systems equipped with two GTX 680 cards running in NVIDIA SLI® configuration.“The GTX 690 is truly a work of art — gorgeous on the outside with amazing performance on the inside,” said Brian Kelleher, senior vice president of GPU engineering at NVIDIA. “Gamers will love playing on multiple screens at high resolutions with all the eye candy turned on. And they’ll relish showing their friends how beautiful the cards look inside their systems.” The GTX 690 graphics card is designed using GeForce GPUs based on NVIDIA’s 28-nm Kepler architecture. The NVIDIA GeForce GTX 690 GPU will be available in limited quantities starting May 3, 2012, with wider availability by May 7, 2012 from NVIDIA’s add-in card partners, including ASUS, EVGA, Gainward, Galaxy, Gigabyte, Inno3D, MSI, Palit and Zotac. This card is expected to retail at $999.








Source: Wccftech

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Friday, April 27, 2012

Gigabyte GTX 680 SOC (Windforce 5X)


This card was Revealed back at Gigabyte’s Tech Tour 2012. The GTX 680 Super Overclock features the Windforce 5X cooler which has been pictured once again. These new set of pictures clearly show the interior of the massive Windforce 5X cooler and some key features of the PCB. The Windforce 5X cooling design features a large densely packed aluminum heatsink  which nine 6mm heatpipes run through it. Total cooling capacity of the heatsink is around 500W which makes it worth for extreme overclockers. To cool it all Gigabyte has added five 40mm fans, though not a good move since the fans rather than blowing air out are located in the central chamber hence blowing hot air at the other PC components. The base plate is copper plated and covers the GPU core and memory chips. Power is provided through 8 + 6 pin connectors. 


 
 

Source: Wccftech 
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Samsung Vs Apple


Samsung latest adverts are to dig at apple, their latest one is somewhat the most strangest protest i've ever seen, Samsung decided to stage a fake protest outside an Apple Store in Australia. Samsung sent a bus load of protesters to an Apple Store in Australia and then had the protesters chanted ‘Wake Up’ outside the store while brandishing some ‘Wake Up signs’, even the bus came with a 'Wake up Sign'. This is obviously another attempt by Samsung to have a dig at Apple. They have also created a website called Wake Up Australia, that has a countdown to the launch of the new Samsung Galaxy S III.
Source: Geekygadgets
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Wednesday, April 25, 2012

GTX 670Ti


According to Fudzilla’s sources, Nvidia is possibly launching the GTX 670Ti along with the GTX 690’s launch that has been slated for 10th May next month. we are three days away to some kind of official announcement by Nvidia at the GeForce LAN / Nvidia Gaming Festival 2012  that takes place in Shanghai, China on the 28th of April. Possibilities are that the participants will get to feast their eyes on the dual GPU card. We hope to see the GTX 690 along with some teaser benchmarks and specifications rundowns. Yet now as per details, the GTX 690 launch will be accompanied by the GTX 670Ti on 10th May. Furthermore, availability of both cards at launch would severe some shortage as TSMC has been experiencing capacity issues in the past month that has affected Qualcomm and AMDs production as well. Earlier reports show that the GTX 680 was a rebranded 670Ti, so there’s a high possibility of this being a GTX 670Ti in reality, sharing the same GK104 chip as the 680 however with a lesser CUDA count and lower clock speeds. 
Source: Wccftech
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Samsung Galaxy S III gets benchmarked

Some leaked benchmarks of the Galaxy S III was spotted by an eagle eyed reader of PhoneArena, shows the GALAXY S III sporting a quad core Exynos 4412 chip that looks like it is the fastest Android based device, and probably the iPhone 4S, not by a bit, but  by a very big margin. In GLBenchmark 2.1.4 Egypt Offscreen, Samsung's GALAXY S II scores around 30fps, with HTC's One X which sports NVIDIA's top of the line quad core Tegra 3 SoC scoring around 65fps, but the GALAXY S III was just all out having 90fps or so. If these benchmarks are true the Galaxy S III will be about 3 times better than its predecessor. While performance and fps is all well and good, battery life is good, too. Apple's iPhone 4S will most likely have a better battery life thanks to Apple's closed off ecosystem, but Samsung's GALAXY S III should feature  the ability the GALAXY S II did, a removable cover which lets you swap batteries. As good as the iPhone is, you can't replace its battery for any reason, without voiding the warranty. Where with the Galaxy S III, you could just rip the back off and have a new, fully charged battery placed. 

Source: Tweaktown
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Tuesday, April 24, 2012

The GTX 690 is Coming

NVIDIA is ready to launch its top of the line 600 series card, the GeForce GTX 690 dual GPU graphics card is slated to launch on the 28th of April, according to a VR-Zone report. NVIDIA has chosen the 2012 NVIDIA GeForce LAN / NVIDIA Gaming Festival (NGF) held in Shanghai, China, as its launchpad. NVIDIA even puts up a countdown timer on GeForce.com that counts down to the event. GeForce GTX 690 combines two 28 nm GK104(GTX 680) graphics processors units for an SLI on a card solution. It is gunning for absolute performance leadership, enabling gamers to throw any game, at any resolution at PCs equipped with it. Below is one of the first leaked image of the card.

Source: Techpowerup, Geforce, Legitreviews
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Monday, April 23, 2012

Samsung Galaxy S III Teaser Trailer

Yesterday, Samsung published a site called tgeltaayehxnx, a website displaying a twenty-four hour countdown, if you try to decode it the link actually is an anagram to 'The Next Galaxy Device'. Today, that countdown hit zero, and if you visit thenextgalaxy.com it brings up a teaser video that shows very little. we were treated to some rather meaningless messages against a Galaxy backdrop, accompanied by a piece from the Mass Effect 2 soundtrack. The video closes with an invite to "stand out from everyone else," who are, apparently yes sheep. How Samsung, which will very soon be the number one phone manufacturer in the world running the World's most popular OS. Either way, the next Galaxy S device will launch on May 3rd at an Samsung Unpacked event in London; which most probably will feature some new technologies.


Source: Theverge
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Sunday, April 22, 2012

Asus Geforce GTX 680 Direct CU II Top

The ASUS GeForce GTX 680 DirectCU II TOP card delivers a true flagship product for dedicated PC gamers and performance enthusiasts. The NVIDIA GeForce GTX 680 GPU has been overclocked by ASUS to 1201 MHz, offering users 143 MHz over reference. The DirectCU II thermal design runs 20% cooler than stock, while the twin 100 mm fans keep noise at bay with 14 dB quieter operation. There are 10-phases of DIGI+ VRM digitally regulated power delivery with 30% noise reduction, working in tandem with durable Super Alloy Power components that last 2.5 longer than reference. Users can tap the greater overclocking and overvolting capabilities of the card through both the hardware-level VGA Hotwire and the software-level through the GPU Tweak utility. There is also the ASUS GeForce GTX 680 DirectCU II OC edition, with a 1019 MHz core capable of a 1084 MHz boost clock. This card uses the same DirectCU II cooler and PCB the non OC edition
Specifications
TOP-selected 1201 MHz core powers smoother gaming
ASUS TOP graphics cards utilize the best-performing GPUs available, chosen via a rigorous set of trials. The GeForce GTX 680 DirectCU II TOP arrives factory-overclocked to 1201 MHz on the core, boosting frame rates for smoother and more fluid gaming in even the most demanding of situations. Due to passing extensive heat tolerance tests, TOP GPUs can handle extra overclocking strain, and are matched by ASUS engineers with an upgraded PCB that can also withstand more heat and stress than reference parts.

DirectCU II creates the coolest and quietest GeForce GTX 680
Especially customized and fitted to match the power of factory-overclocked GeForce GTX 680 GPUs, the exclusive ASUS DirectCU II thermal design lowers temperatures to ensure faster, quieter, more stable, and longer lasting performance. Using five all-copper heatpipes and a 20% bigger dissipation area than reference, DirectCU II guarantees more expedient heat removal. It also features twin 100 mm sound-dampened fans for increased airflow, resulting in 20% cooler and 14 dB quieter operation on average compared to reference GeForce GTX 680s. This allows gamers to enjoy the utmost performance with minimized noise interference, a highly coveted and appealing proposition.

DIGI+ VRM with 10-phase Super Alloy Power
The GeForce GTX 680 DirectCU II plays host to two exclusive ASUS power delivery technologies. DIGI+ VRM, based on a design used on bestselling ASUS motherboards since 2010, offers digital voltage regulators for a wider modulation range and therefore more flexible overclocking. The version of DIGI+ VRM used here applies 10-phase delivery and reduces power noise by as much as 30% compared to reference. Reduced power noise translates into more stable power supply and thus more consistent and reliable card performance. Combined with extra-durable and anti-corrosive Super Alloy Power components (solid state capacitors, chokes, and MOSFETs), DIGI+ VRM contributes to a card that runs 15% more efficient than reference models while maintaining 2.5 times the product lifespan.

Overclocking duo: software and hardware tuning enabled
The GeForce GTX 680 DirectCU II TOP ships with extensive software overclocking by way of GPU Tweak, the exclusive ASUS card tuning suite. Using a highly intuitive interface, GPU Tweak helps users adjust clocks (including new boost clock settings), power consumption targets, voltages, and fan speeds, with multiple profiles available for different applications and needs. This is complemented by the addition of VGA Hotwire, a feature previously offered by ASUS ROG motherboards. For DIY-minded users, VGA Hotwire presents the benefit of more precise and complete hardware-level overvolting. Users can solder wires directly onto voltage regulators for more accurate Vcore, Vmem, and PLL readings and adjustments, opening up even more of the powerful card’s potential.


Source: Techpowerup and Asus
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Samsung Galaxy S III Countdown

Samsung is releasing or previewing something at 5:00 am PST. This should be most probably a teaser to their May 3rd event, specifically the next Samsung Galaxy S device. They have a countdown timer on this site  http://www.tgeltaayehxnx.com/. This will most probably reveal either a video or some new technologies in the next Galaxy S device. We will bring you the latest updates as soon as we get something.

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Friday, April 20, 2012

Samsung Galaxy S III spotted on amazon germany

These few days Samsung is on high security for the upcoming Galaxy S, this is the tightest security in the company's history, but it may have just sprung a leak; thanks to Amazon GermanyBestBoyZ noticed that a listing for the device appeared on Amazon Germany's site, the highlight's are a 4.7-inch Super AMOLED screen, 12-megapixel camera, and Ice Cream Sandwich. The phone's storage is listed as 16GB, and expandable up to 32GB which would seem to be a limitation if a microSD slot is included. Finally, only partial information is provided, and it could be simply indicating that a 32GB version will be available. Nevertheless there is just another week or so till the launch of the device, we are expecting to hear some sort of news about the future Galaxy line of devices on May 3rd in London.


Source: Theverge via BestBoyZ
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Samsung Galaxy S III test unit leaked


Yesterday there was a leaked image about the device, but the guys from Tinhte.vn got their hands on just that device and shot an informative video that reveals a lot about the phone. The design shown in the video is not the final design. All the hardware is packed in a box to let the carriers test it. This was done to prevent any leaks of what the final device will look like. The hardware should be identical to the retail version and the video shows Android System Info running on the phone, so it reveals several key specs. The first is a Samsung-made quad-core processor running at 1.4GHz, a Mali-400MP GPU (same as on the current Galaxy S II) and a screen with 320ppi pixel density (720 by 1184). The screen has 720p resolution, which works out to a 4.6" or a 4.65"  diagonal with the quoted density. Part of the screen is reserved for ICS-style on-screen controls, These also confirms the 5 buttons which are on the phone (3 on screen 2 capacitive), furthermore it still lacks the physical home button the rumors suggest. The screen would most probably be a Super AMOLED device, though it is not confirmed it can either be a plus or a HD or just standard AMOLED. At the back of the device reveals a microSD card slot to expand the 16GB of built-in memory, next to the SD card slot is a SIM slot of about the same size, so the Galaxy S III should be using the microSIM standard. The battery has an ample 2050mAh capacity and the phone will support NFC connectivity.The camera interface on the Samsung Galaxy S III reports a maximum resolution of 8MP and not 12MP as earlier rumors suggested. This could be just a software limitation, but there's no way to know for sure, at least until the official announcement comes. All this will be settled when the Galaxy S III Successor is revealed.
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Thursday, April 19, 2012

MSI Power Edition Graphic Cards for Radeon


Leading international graphics card maker MSI today officially released three of their R7000 Power Edition graphics cards; the R7850 Power Edition 2GD5/OC, R7770 Power Edition 1GD5/OC and R7750 Power Edition 1GD5/OC. The MSI Power Edition cards will all support MSI's exclusive Triple Overvoltage function and improved PWM to boost over clocking potential up to 45%. The R7850 Power Edition 2GD5/OC is equipped with MSI’s new Twin Frozr IV Thermal Design recently exclusive to the R7970 Lightning and the R7870 HawkThe dual 8cm Propeller Blade technology fans create powerful airflow and rapid heat dissipation to reduce the GPU temperature by up to 22℃. The R7770 Power Edition 1GD5/OC and R7750 Power Edition 1GD5/OC feature the all new MSI TransThermal thermal design. The MSI TransThermal thermal design allows customization of their graphics cards fan setup: Single fan, Dual fan and Stacked fan setup. MSI’s TransThermal comes with both Dust Removal and Propeller Blade technologies. Fans can also The MSI R7000 Power Edition series graphics cards’ exceptional overclocking performance, all-new cooling module design and the latest Military Class III components make it the best choice for gamers. Some of the additional features explained more deeply:
Power Edition architecture boosts overclocking potential
The Power Edition architecture on MSI’s latest R7000 series graphics cards enables Triple Overvoltage inside MSI Afterburner. The GPU/Memory/VDDCI voltages can be adjusted to extract every ounce of performance from the graphics card and gives up to 45% overclocking potential. The enhanced PWM provides more power than the reference design to improve power delivery and stability under the high loads experienced during overclocking.
Dust Removal Fan Technology for Optimal Cooling
The MSI R7850 Power Edition 2GD5/OC graphics card features the latest Twin Frozr IV cooling design. Cooling performance is greatly improved by the large-area nickel-plated copper base and Propeller Blade dual 8cm fans. Dust Removal technology runs the fans in reverse for 30 seconds after every boot to remove dust from the heat sink to maintain optimal cooling of the graphics card.
TransThermal - Exclusive customizable fan design
In an industry first, the MSI R7770 Power Edition 1GD5/OC and R7750 Power Edition 1GD5/OC graphics cards feature the MSI TransThermal thermal design that allows the cooling module to be customized to your taste. In addition to the integrated Propeller Blade and Dust Removal technologies, a special mechanism allows gamers to install another fan on the TransThermal cooler. The upgrade converts the original cooling module to a Double Airflow mode for increased airflow and lower temperatures; the cover of the cooling module on the R7770 Power Edition 1GD5/OC can even be adjusted so the add-on fan can be installed in parallel with the existing module. This expands the cooling coverage of the Dual Fan mode, lowering temperatures on the entire card.

Premium Military Class III Components
MSI has long been an industry leader in setting the standards for product quality and stability. The MSI R7000 Power Edition graphics cards use Military Class III components that have been certified by an independent laboratory to confirm they meet MIL-STD-810G military specifications. The Tantalum Core Hi-c CAP with 8 times the life of conventional capacitors and the SFC that delivers 30% more current and Solid CAP with up to 10 years of service life all combine to deliver maximum stability for MSI graphics cards.

Available models

  • R7850 Power Edition 2GD5/OC
  • R7770 Power Edition 1GD5/OC
  • R7750 Power Edition 1GD5/OC
The R7770 Power Edition With one fan (Stock Settings)
The R7770 Power Edition with 2 fans 
The R7750 Power edition with The Transthermal fan Design

The PCB of the R7750 Power Edition as you can see there are metal plates surrounding the VRM components




Source: TechpowerupMSI
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