Tuesday, February 12, 2013

BlackBerry Z10 Teardown Reveals The Hardware Powering The First BlackBerry 10 Device, Samsung & Qualcomm Hardware Written All Over It

With the launch of BB10 and the Z10 a few weeks back we have feasted on reviews, opinions and also drop tests. But we still have not seen any teardowns of the device yet. UBM Tech Insights has gone ahead and tearing the Z10 apart and showing its guts which turns out to have a lot of Samsung and Qualcomm branded hardware. Well here is the whole list of parts inside the device, also below are a couple of images of the teardown if you would like to see more click here
  • Samsung K3PE0E000A - Multichip Memory - 2 GB Mobile DDR2 SDRAM 
  • Samsung KLMAG2GE4A - Multichip Memory - 16 GB MLC NAND Flash, Controller 
  • Qualcomm MSM8960 - Snapdragon S4 Baseband / Applications Processor 
  • Qualcomm WCD9310 - Audio Codec 
  • Qualcomm PM8921 - Power Management IC
  • Qualcomm RTR8600 - GSM / CDMA / W-CDMA / LTE RxD Transceiver + GPS 
  • Texas Instruments WL1273L - Single-Chip 802.11a/b/g/n WLAN, Bluetooth, and FM 
  • TriQuint TQP6M9017 - Dual-Band WLAN Module
  • RF Micro Devices RF7252 - CDMA/WCDMA BAND 2 Linear Power Amplifier Module
  • RF Micro Devices RF7303 - LTE/UMTS/CDMA BAND 3 Linear Power Amplifier Module
  • Inside Secure SECUREAD IC5C633I4- NFC Solution Module
  • Avago ACPM-5017 - LTE Band XVII Power Amplifier 
  • Avago ACPM-7051 - Quad-Band GSM / W-CDMA Bands I & V Power Amplifier 
  • Sony CXM3582UR - SP10T Antenna Switch 
  • ST Microelectronics LIS3DH - MEMS Accelerometer
  • STMicroelectronics LSM330DLC - 3D Accelerometer & 3D Gyroscope
  • Synaptics Clearpad 3203 - Capacitive Touchscreen Controller
Source: Phonearena via TechInsights
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